senior Manager - technology integration developmentInfineon
Workplace: MetroManila, Manila
Salary: Agreement
Work form: Full time
Posting Date: 09/11/2025
Deadline: 07/09/2021
Location: Manila
Job ID: 323023
Job description
In your new role you will:
Development of process, equipment, tooling and materials to support the new semiconductor packaging
Package and product qualification in accordance with Infineon Development Business Process
Management of risks associated with semiconductor package development
Introduce / innovate necessary improvements in design and process to achieve development goals
Manages the technical aspects of package and product development
Work with teams involving members from Infineon and Backend Assembly subcontractor on package / product development and qualification
Your profile
You are best equipped for this task if you have:
Bachelor's Degree in Mechanical / Electronics / Electrical Engineering with at least 8 years work experience in semiconductor packaging development
Excellent problem solving skills in complex technical issues using 8D, statistics (JMP, Minitab) and other tools
Significant experience on actual use of Design of Experiment (DOE)
Working experience with Infineon project teams / subcontractors / employees / resource
Solid knowledge on various standards such as JEDEC, IPC, Geometric Dimensioning
Outstanding work attitude and appreciation on achieving goals
Part of your life. Part of tomorrow.
We make life easier, safer and greener - with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world - we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.
The backend segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!
(It only takes 90 seconds)
Infineon
Job ID: 323023
Job description
In your new role you will:
Development of process, equipment, tooling and materials to support the new semiconductor packaging
Package and product qualification in accordance with Infineon Development Business Process
Management of risks associated with semiconductor package development
Introduce / innovate necessary improvements in design and process to achieve development goals
Manages the technical aspects of package and product development
Work with teams involving members from Infineon and Backend Assembly subcontractor on package / product development and qualification
Your profile
You are best equipped for this task if you have:
Bachelor's Degree in Mechanical / Electronics / Electrical Engineering with at least 8 years work experience in semiconductor packaging development
Excellent problem solving skills in complex technical issues using 8D, statistics (JMP, Minitab) and other tools
Significant experience on actual use of Design of Experiment (DOE)
Working experience with Infineon project teams / subcontractors / employees / resource
Solid knowledge on various standards such as JEDEC, IPC, Geometric Dimensioning
Outstanding work attitude and appreciation on achieving goals
Part of your life. Part of tomorrow.
We make life easier, safer and greener - with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world - we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.
The backend segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!
(It only takes 90 seconds)
Infineon
Other Info
Manila City, Metro Manila
Permanent
Full-time
Permanent
Full-time
Submit profile
Infineon
About the company
Position senior Manager - technology integration development recruited by the company Infineon at MetroManila, Manila, Joboko automatically collects the salary of , finds more jobs on Senior Manager - Technology Integration Development or Infineon company in the links above