Manager package developmentInfineon

Location: Manila
Job ID: 358305
Job description
In your new role you will:
Supports the technical aspect of New Product Introduction (NPI) Projects at Outsource Assembly and Test (OSAT) subcontractors
Meet customer requirements in terms of timeline, cost and quality.
Risk assessment and mitigation of NPI Projects
Resolution of manufacturability and reliability issues of NPI Projects
Your profile
You are best equipped for this task if you have:
Bachelor/Master's Degree in Engineering/Science
At least 10 years experience in semiconductor packaging industry involving process engineering and package development
Experience in specifying design and materials to meet requirements of new packages & products at Outsourced Assembly and Test(OSAT)subcontractors
Package development experience in TO, QFN, Cu Clip, SOIC, QFP, FlipChip, and Laminate based Packages
Knowledgeable in industry standards for package reliability test and qualifications
Familiar with failure analysis techniques
Working knowledge of DFMEA and PFMEA during design and development phases and ability to create strategies to mitigate risks
User of AutoCAD software
User of statistical analysis software (ex. JMP/Minitab)
Part of your life. Part of tomorrow.
Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!
(It only takes 90 seconds)
Infineon

Manila City, Metro Manila
Permanent
Full-time