Location: Muntinlupa City
Job ID: 331705
Job description
In your new role you will:
Supports the technical aspect of New Product Introduction (NPI) Projects in Subcontractors
Meet customer requirements in terms of timeline, cost and quality.
Risk assessment and mitigation of NPI Projects
Resolution of manufacturability and reliability issues of NPI Projects
Your profile
You are best equipped for this task if you have:
Bachelor/Master's degree in Engineering/Science
Experience in specifying design and materials to meet requirements of new packages & products
Package development experience in TO, QFN, Cu Clip, SOIC, QFP, Flip Chip, and Laminate based Packages
Knowledgeable in industry standards for package reliability test and qualifications
Familiar with failure analysis techniques
Knowledge of the entire assembly process
Process specialization in any of the major assembly processes (DA,WB, Mold)
Can interpret package simulation results
Close interaction with chip designer, application team, marketing and business units for new product design and project roadmaps
Communicate technical results to customers and stakeholders
Assess and mitigate technical risks
Working knowledge of DFMEA during design phase and ability to create strategies to mitigate risks
Support the technical requirements of prototype and sample builds
Collaborate with the Project Manager, Quality and Operations personnel within a project team
User of AutoCAD and statistical analysis software
Part of your life. Part of tomorrow.
We make life easier, safer and greener - with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world - we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!
(It only takes 90 seconds)
Infineon
Job ID: 331705
Job description
In your new role you will:
Supports the technical aspect of New Product Introduction (NPI) Projects in Subcontractors
Meet customer requirements in terms of timeline, cost and quality.
Risk assessment and mitigation of NPI Projects
Resolution of manufacturability and reliability issues of NPI Projects
Your profile
You are best equipped for this task if you have:
Bachelor/Master's degree in Engineering/Science
Experience in specifying design and materials to meet requirements of new packages & products
Package development experience in TO, QFN, Cu Clip, SOIC, QFP, Flip Chip, and Laminate based Packages
Knowledgeable in industry standards for package reliability test and qualifications
Familiar with failure analysis techniques
Knowledge of the entire assembly process
Process specialization in any of the major assembly processes (DA,WB, Mold)
Can interpret package simulation results
Close interaction with chip designer, application team, marketing and business units for new product design and project roadmaps
Communicate technical results to customers and stakeholders
Assess and mitigate technical risks
Working knowledge of DFMEA during design phase and ability to create strategies to mitigate risks
Support the technical requirements of prototype and sample builds
Collaborate with the Project Manager, Quality and Operations personnel within a project team
User of AutoCAD and statistical analysis software
Part of your life. Part of tomorrow.
We make life easier, safer and greener - with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world - we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!
(It only takes 90 seconds)
Infineon
Other Info
Muntinlupa City, Metro Manila
Permanent
Full-time
Permanent
Full-time
Submit profile
Infineon
About the company
Position Manager package design development recruited by the company Infineon at MetroManila, Manila, Muntinlupa, Joboko automatically collects the salary of , finds more jobs on Manager Package Design Development or Infineon company in the links above
About the company