Manager - package design developmentInfineon
Workplace: MetroManila, Manila, Muntinlupa
Salary: Agreement
Work form: Full time
Posting Date: 15/11/2025
Deadline: 06/03/2021
Location: Muntinlupa City
Job ID: 312340
Job description
In your new role you will:
Supports the technical aspect of New Product Introduction (NPI) projects, including risk assessment and mitigation
Ensure that customer requirements are met in terms of timeline, cost and quality
Manage manufacturability and reliability issues of NPI projects and provide innovative solutions
Close interaction with chip designer, application team, marketing and business units for new product design and project roadmaps
Communicate technical results to customers and stakeholders
Support the technical requirements of prototype and sample builds
Collaborate with the Project Manager, Quality and Operations personnel within a project team
Your profile
You are open to new ideas and receptive to other ways of thinking or working and have the passion and the courage to develop new and creative ideas. You demonstrate strong interpersonal skills and know how to establish lasting relationships and networks with colleagues and clients. With your structured working style, you are able to demonstrate high quality standards for yourself and other people.
You are best equipped for this task if you have:
Master's / Bachelor's Degree in Engineering / Science with package development experience in TO, QFN, Cu Clip, SOIC, QFP, FlipChip, and Laminate based packages
Hands-on experience in specifying design and materials to meet requirements of new packages & products
Knowledgeable in industry standards for package reliability test and qualifications
Working knowledge of DFMEA during design phase and ability to create strategy to mitigate the risk
Familiar with failure analysis techniques
Knowledgeable in assembly processes preferably with specialization in wirebond
Strong communication skill with ability to interpret package simulation results
Skilled in AutoCAD software
Part of your life. Part of tomorrow.
We make life easier, safer and greener - with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world - we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.
The backend segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!
(It only takes 90 seconds)
Infineon
Job ID: 312340
Job description
In your new role you will:
Supports the technical aspect of New Product Introduction (NPI) projects, including risk assessment and mitigation
Ensure that customer requirements are met in terms of timeline, cost and quality
Manage manufacturability and reliability issues of NPI projects and provide innovative solutions
Close interaction with chip designer, application team, marketing and business units for new product design and project roadmaps
Communicate technical results to customers and stakeholders
Support the technical requirements of prototype and sample builds
Collaborate with the Project Manager, Quality and Operations personnel within a project team
Your profile
You are open to new ideas and receptive to other ways of thinking or working and have the passion and the courage to develop new and creative ideas. You demonstrate strong interpersonal skills and know how to establish lasting relationships and networks with colleagues and clients. With your structured working style, you are able to demonstrate high quality standards for yourself and other people.
You are best equipped for this task if you have:
Master's / Bachelor's Degree in Engineering / Science with package development experience in TO, QFN, Cu Clip, SOIC, QFP, FlipChip, and Laminate based packages
Hands-on experience in specifying design and materials to meet requirements of new packages & products
Knowledgeable in industry standards for package reliability test and qualifications
Working knowledge of DFMEA during design phase and ability to create strategy to mitigate the risk
Familiar with failure analysis techniques
Knowledgeable in assembly processes preferably with specialization in wirebond
Strong communication skill with ability to interpret package simulation results
Skilled in AutoCAD software
Part of your life. Part of tomorrow.
We make life easier, safer and greener - with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world - we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.
The backend segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!
(It only takes 90 seconds)
Infineon
Other Info
Muntinlupa City, Metro Manila
Permanent
Full-time
Permanent
Full-time
Submit profile
Infineon
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Position Manager - package design development recruited by the company Infineon at MetroManila, Manila, Muntinlupa, Joboko automatically collects the salary of , finds more jobs on Manager - Package Design Development or Infineon company in the links above