Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.
Job Description
Performs detailed electrical and physical failure analysis for all Microchip products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and ATE datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Optical Beam-Induced Resistance Change (OBIRCH), Thermal Hotspot Analysis, and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical etch, or combination of different etches), and SEM/EDX analysis.
Works with fellow FA engineers/technicians both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities if needed.
Works with different cross-functional team such as counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, Line Engineering and technicians, and Wafer fab as appropriate to resolve FA cases.
Reviews the assigned failure analysis case and requests additional information if needed.
Ensures that historical data are reviewed for any relevant information that can be used for the analysis.
Performs and/or reviews initial analysis results and define appropriate next analysis steps.
Provides regular FA updates and timeline to customer.
Ensures that FA reports are release on time based on target average cycle time.
Assists/trains/mentors FA Inspectors and Technicians if needed.
FA focal person responsible in advanced tools/equipment 5S and improvements and coordination with FAREL Equipment group for consumables & spare parts procurements, repair, and maintenance.
Generates comprehensive failure Analysis Report based on analysis findings.
Supports and implements Environmental Management Systems and Quality Management Systems standards
Observes safety and housekeeping "Clean as you go" during day-to-day failure analysis activities.
Develops and implements new failure analysis methods/techniques if necessary.
Job Requirements
Preferably Graduate of Bachelor of Science in Electronics Engineering or Electrical Engineering.
New college graduate (NCG) with strong fundamentals in electronic, material science, and programming skills.
Satisfactory knowledge and experience in electronic /electrical circuit and material analysis.
Able extract, analyze, and report data as necessary.
Computer literate (MS Word, PowerPoint, and Excel).
Able to communicate and coordinate throughout all levels and functions of the organization as a team player with little supervision.
Satisfactory knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.
Good interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions
Percentage of Shift and Longest Time (Enter Standing %, Walking %, Sitting %, Driving %, Inside %, Outside %, Hours standing, walking, sitting, driving, and Usual shift hours and days)
70% sitting, 30% walking and standing
Check Each Essential Physical Functions, Maximum LBS and Working Conditions
Handling, Feeling, Hearing, Talking, Seeing, Works Alone, Works Around Others
Microchip Technology
Job Description
Performs detailed electrical and physical failure analysis for all Microchip products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and ATE datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Optical Beam-Induced Resistance Change (OBIRCH), Thermal Hotspot Analysis, and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical etch, or combination of different etches), and SEM/EDX analysis.
Works with fellow FA engineers/technicians both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities if needed.
Works with different cross-functional team such as counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, Line Engineering and technicians, and Wafer fab as appropriate to resolve FA cases.
Reviews the assigned failure analysis case and requests additional information if needed.
Ensures that historical data are reviewed for any relevant information that can be used for the analysis.
Performs and/or reviews initial analysis results and define appropriate next analysis steps.
Provides regular FA updates and timeline to customer.
Ensures that FA reports are release on time based on target average cycle time.
Assists/trains/mentors FA Inspectors and Technicians if needed.
FA focal person responsible in advanced tools/equipment 5S and improvements and coordination with FAREL Equipment group for consumables & spare parts procurements, repair, and maintenance.
Generates comprehensive failure Analysis Report based on analysis findings.
Supports and implements Environmental Management Systems and Quality Management Systems standards
Observes safety and housekeeping "Clean as you go" during day-to-day failure analysis activities.
Develops and implements new failure analysis methods/techniques if necessary.
Job Requirements
Preferably Graduate of Bachelor of Science in Electronics Engineering or Electrical Engineering.
New college graduate (NCG) with strong fundamentals in electronic, material science, and programming skills.
Satisfactory knowledge and experience in electronic /electrical circuit and material analysis.
Able extract, analyze, and report data as necessary.
Computer literate (MS Word, PowerPoint, and Excel).
Able to communicate and coordinate throughout all levels and functions of the organization as a team player with little supervision.
Satisfactory knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.
Good interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions
Percentage of Shift and Longest Time (Enter Standing %, Walking %, Sitting %, Driving %, Inside %, Outside %, Hours standing, walking, sitting, driving, and Usual shift hours and days)
70% sitting, 30% walking and standing
Check Each Essential Physical Functions, Maximum LBS and Working Conditions
Handling, Feeling, Hearing, Talking, Seeing, Works Alone, Works Around Others
Microchip Technology
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Microchip Technology jobs
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