die attach staff ENGINEERJOBSCONNECT MANPOWER AGENCY, INC.
Salary: MYR 3,000.00 - 5,000.00 per month
Work form: Full time
Posting Date: 17/12/2024
Deadline: 17/01/2025
Job Description
1. Responsible for Die Prep/ Die Attach process and equipment as demonstrated by the yield, quality, reliability performance of all customer products.
2. Drive equipment capability, upgrading/modernization, sustainability, equipment efficiency & stability
3. Knowledge and exposure in wafer back grind, dicing, AOI, die attach, hands-on in Disco/ Okamoto/ASM/ ESEC equipment and troubleshooting is a must.
4. Drive, establish and implement process simplification/optimization programs/ process &equipment automation projects to improve yield, quality, lead time & cost
5. Drive cost saving projects through improve & qualify new cost-effective factory supplies and indirect material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
6. Manage of spare parts for equipment and repair of damage parts. 7. In charge of customer accounts to provide solution on technical difficulties/new technologies challenges, business review, calibrate new products & technology roadmap.
8. Lead in knowledge GURU programs, to up-skill workforce productivity & agility.
Qualifications:
A minimum of 5 year(s) of working experience is required.
Candidates must be a Bachelor's / College Degree holder in Engineering(Electrical/Electronic) or similar fields.
Male applicants are preferred for this role.
Must possess strong knowledge in Die-Attach process involving multi-die stack technology (up to 16 die-stack) in memory product manufacturing.
Practical experiences with all the equipment's in die prep process and maintenance. Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, preventive maintenance.
Additional Information:
Experience in Semiconductor industry is an advantage
ASE Malaysia Products: Lead Frame Packaging, Wire Bond BGA, Flip Chip Packaging, Power DFN/QFN with Cu Clip, Memory Packaging & WLCSP (backend)
Principal / Employer
ASE ELECTRONICS (M) SDN BHD
Principal / Employer Address
Free Industrial Zone, Bayan Lepas, Phase 4 Pulau, Penang, Malaysia
DMW Registration / Accreditation No.
10413737101525
Placement Fee
This job has no placement fee.
1. Responsible for Die Prep/ Die Attach process and equipment as demonstrated by the yield, quality, reliability performance of all customer products.
2. Drive equipment capability, upgrading/modernization, sustainability, equipment efficiency & stability
3. Knowledge and exposure in wafer back grind, dicing, AOI, die attach, hands-on in Disco/ Okamoto/ASM/ ESEC equipment and troubleshooting is a must.
4. Drive, establish and implement process simplification/optimization programs/ process &equipment automation projects to improve yield, quality, lead time & cost
5. Drive cost saving projects through improve & qualify new cost-effective factory supplies and indirect material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
6. Manage of spare parts for equipment and repair of damage parts. 7. In charge of customer accounts to provide solution on technical difficulties/new technologies challenges, business review, calibrate new products & technology roadmap.
8. Lead in knowledge GURU programs, to up-skill workforce productivity & agility.
Qualifications:
A minimum of 5 year(s) of working experience is required.
Candidates must be a Bachelor's / College Degree holder in Engineering(Electrical/Electronic) or similar fields.
Male applicants are preferred for this role.
Must possess strong knowledge in Die-Attach process involving multi-die stack technology (up to 16 die-stack) in memory product manufacturing.
Practical experiences with all the equipment's in die prep process and maintenance. Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, preventive maintenance.
Additional Information:
Experience in Semiconductor industry is an advantage
ASE Malaysia Products: Lead Frame Packaging, Wire Bond BGA, Flip Chip Packaging, Power DFN/QFN with Cu Clip, Memory Packaging & WLCSP (backend)
Principal / Employer
ASE ELECTRONICS (M) SDN BHD
Principal / Employer Address
Free Industrial Zone, Bayan Lepas, Phase 4 Pulau, Penang, Malaysia
DMW Registration / Accreditation No.
10413737101525
Placement Fee
This job has no placement fee.
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JOBSCONNECT MANPOWER AGENCY, INC.
About the company
Wirebond Process Staff Engineer (16 Die-Stack)
MYR 3,000.00 - 5,000.00 per month
Position die attach staff ENGINEER recruited by the company JOBSCONNECT MANPOWER AGENCY, INC. at , Joboko automatically collects the salary of MYR 3,000.00 - 5,000.00 per month, finds more jobs on DIE ATTACH STAFF ENGINEER or JOBSCONNECT MANPOWER AGENCY, INC. company in the links above
About the company