die attach section HEADJOBSCONNECT MANPOWER AGENCY, INC.

Job Description
4. Drive, establish and implement process simplification/optimization programs/ process &equipment automation projects to improve yield, quality, lead time & cost
5. Drive cost saving projects through improve & qualify new cost-effective factory supplies and indirect material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
6. Manage of spare parts for equipment and repair of damage parts. 7. In charge of customer accounts to provide solution on technical difficulties/new technologies challenges, business review, calibrate new products & technology roadmap.
8. Lead in knowledge GURU programs, to up-skill workforce productivity & agility.
Qualifications:
A minimum of 8 year(s) of working experience is required.
Candidates must be a Bachelor's / College Degree holder in Engineering(Electrical/Electronic) or similar fields.
Male applicants are preferred for this role.
2. Drive equipment capability, upgrading/modernization, sustainability, equipment efficiency & stability
3. Knowledge and exposure in wafer back grind, dicing, AOI, die attach, hands-on in Disco/ Okamoto/ASM/ ESEC equipment and troubleshooting is a must.
Additional Information:
Experience in Semiconductor industry is an advantage
ASE Malaysia Products: Lead Frame Packaging, Wire Bond BGA, Flip Chip Packaging, Power DFN/QFN with Cu Clip, Memory Packaging & WLCSP (backend)
Principal / Employer
ASE ELECTRONICS (M) SDN BHD
Principal / Employer Address
Free Industrial Zone, Bayan Lepas, Phase 4 Pulau, Penang, Malaysia
DMW Registration / Accreditation No.
10413737101525
Placement Fee
This job has no placement fee.