sr. manager for package development EngineeringON Semiconductor
Salary: Agreement
Work form: Full time
Posting Date: 07/11/2025
Deadline: 28/08/2022
Responsible from inception until full release of new packages
To achieve on time, on quality and at the right performances part release rate thru DFM
To establish the engineering team, methodology to be the best in class package technology development center
To build communication channel with cross function teams
Set the clear directions and goals for package development engineering team, which is aligned with Business Units and corporate R&D strategy
Build in depth technical competencies to handle package and assembly technical challenges
Through direct communication and alignment with cross functional teams to achieve the team KPIs
Strong interaction with Manufacturing, Reliability and Business Units to close engineering gap and smoothly production transfer
Develop and grow engineer competencies to handle the challenging technology development
Define and execute packaging, process and material roadmaps
Outline package characterization plan and study cost effectiveness
Qualifications
Master's or Bachelor's degree in Engineering, Physics or Chemistry
15+ years of semiconductor packaging engineering experience
Hands-on assembly development and manufacturing experience
Analytical skills: process, materials and assembly equipment parameters
Leadership/people management experience
ON Semiconductor
To achieve on time, on quality and at the right performances part release rate thru DFM
To establish the engineering team, methodology to be the best in class package technology development center
To build communication channel with cross function teams
Set the clear directions and goals for package development engineering team, which is aligned with Business Units and corporate R&D strategy
Build in depth technical competencies to handle package and assembly technical challenges
Through direct communication and alignment with cross functional teams to achieve the team KPIs
Strong interaction with Manufacturing, Reliability and Business Units to close engineering gap and smoothly production transfer
Develop and grow engineer competencies to handle the challenging technology development
Define and execute packaging, process and material roadmaps
Outline package characterization plan and study cost effectiveness
Qualifications
Master's or Bachelor's degree in Engineering, Physics or Chemistry
15+ years of semiconductor packaging engineering experience
Hands-on assembly development and manufacturing experience
Analytical skills: process, materials and assembly equipment parameters
Leadership/people management experience
ON Semiconductor
Other Info
Philippines
Permanent
Full-time
Permanent
Full-time
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ON Semiconductor
About the company
ON Semiconductor jobs
Carmona, Calabarzon
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