senior Engineer Ii-failure analysisMicrosemi

At Microchip, we work every day to innovate and develop products that solve our customers' technology challenges. Our team of more than 20,000 people worldwide is dedicated to delivering on the promise of working together to improve lives. Learn abou At Microchip, we work every day to innovate and develop products that solve our customers' technology challenges. Our team of more than 20,000 people worldwide is dedicated to delivering on the promise of working together to improve lives. Learn about our that are the building blocks and foundation of our culture and discover how we make a positive impact in the communities in which we operate. We believe our culture fosters trust, collaboration and belonging. Our people serve the industrial, computing, automotive, communications, aerospace and defense, and consumer market segments. As part of our global team, you can build technology solutions in our six growth areas - 5G, data centers, autonomous driving, the Internet of Things, electric vehicles, and artificial intelligence and machine learning. Around the world, we are committed every day to recruiting, retaining and promoting people in our diverse workforce. Your perspective, passion and ingenuity will contribute to achieving more as we fulfill our as a leading provider of smart, connected and secure embedded control solutions. Join our community of exceptional people doing incredible things. Job Description: Leads/manages the team that handles specific divisions/BUs Product Failure Analysis. Performs detailed electrical and physical failure analysis for cutting edge products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and ATE datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Thermal Emission/Hotspot Analysis, Optical Beam-Induced Resistance Change (OBIRCH), and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical polishing, or combination of different etches), and SEM/EDX analysis. Works with fellow engineers both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities if needed. Works with different cross-functional team such as FA counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, Line Engineering and technicians, and Wafer fab as appropriate to resolve individual and team FA cases. Works with external or 3rd party FA laboratory to utilize advanced FA technique capabilities needed for analysis. Reviews assigned failure analysis case and request additional information if needed. Ensures that historical data are reviewed for any relevant information that can be used for the analysis. Performs and/or reviews initial analysis and define appropriate next analysis steps. Provides regular FA updates and timeline to customer. Ensures that FA reports are release on time based on target average cycle time. FA focal person responsible in advanced tools/equipment 5S and improvements and coordination with FAREL Equipment group for consumables & spare parts procurements, repair, and maintenance. Generates and reviews comprehensive failure Analysis Report based on analysis findings. Supports Environmental Management Systems and Quality Management Systems standards. Observe safety and housekeeping 'Clean as you go' during day-to-day failure analysis activities. Develops and implements new failure analysis methods. Drives and leads the task force/teams in solving complex FA cases. Requirements/Qualifications: Mandatory Skills: Strong knowledge and experience in electronic /electrical circuit and material analysis. Able extract, analyze, and report data as necessary. Computer literate (MS Word, PowerPoint, and Excel). Excellent knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment. Strong interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions. Education: Preferably Graduate of BSEcE/MSEcE, BSEE/MSEE, BS Physics w/ a semiconductor bias. Experience Has minimum of 8 years relevant experience in a semiconductor or electronics manufacturing environment with work experience from Quality and Reliability, Failure Analysis, Product or Process Engineering.
Monster

Philippines
Permanent
Full-time