About the role The Package Architect works hand in and with the Front End or FAB technology lead in developing technology roadmaps in integrating new Trench or Silicon process and materials to standard Back End (Assembly and Test) released packages and Assembly Process.
What you will do
Works with R&D and Central Engineering Development Engineers on establishing the process for the new Trench
Works with other cross functional team such as materials, supplier quality, procurement, for other needs on the new trench.
Works with the Project / Program Managers to accomplish the deliverables of the new trenches.
What you will need
Graduate of an Engineering course
At least 12 years experience in Semiconductor Industry with background in FAB, Assembly, Test, and Packaging. He must have experience developing process, introducing new products.
Expert in Assembly process (from Die Prep to Mold) and Packaging process. Expertise in Clipbond process a plus.
Autocad know-how a plus
Familiar with AECQ100/101, ZVEI, PPAP, CDCQ, and other Automotive Requirements
Adept in Failure Analysis Techniques.
About the team
When you join our company, you join our team. TeamNexperia, an 11,000+ strong international network that both supports and challenges you to grow. We listen to each other and work together with enthusiasm, energy and encouragement to get things done efficiently. Constantly pushing the boundaries, we collaborate with our customers, partners and local communities to meet ever-increasing expectations regardless of the challenges we face. Priding ourselves on going the extra mile to achieve world-class results. And valuing the passion, professionalism and perseverance each one of us brings, to make Nexperia the Efficiency Company
More information?
For more details please contact: [Protected Info].
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
Nexperia
What you will do
Works with R&D and Central Engineering Development Engineers on establishing the process for the new Trench
Works with other cross functional team such as materials, supplier quality, procurement, for other needs on the new trench.
Works with the Project / Program Managers to accomplish the deliverables of the new trenches.
What you will need
Graduate of an Engineering course
At least 12 years experience in Semiconductor Industry with background in FAB, Assembly, Test, and Packaging. He must have experience developing process, introducing new products.
Expert in Assembly process (from Die Prep to Mold) and Packaging process. Expertise in Clipbond process a plus.
Autocad know-how a plus
Familiar with AECQ100/101, ZVEI, PPAP, CDCQ, and other Automotive Requirements
Adept in Failure Analysis Techniques.
About the team
When you join our company, you join our team. TeamNexperia, an 11,000+ strong international network that both supports and challenges you to grow. We listen to each other and work together with enthusiasm, energy and encouragement to get things done efficiently. Constantly pushing the boundaries, we collaborate with our customers, partners and local communities to meet ever-increasing expectations regardless of the challenges we face. Priding ourselves on going the extra mile to achieve world-class results. And valuing the passion, professionalism and perseverance each one of us brings, to make Nexperia the Efficiency Company
More information?
For more details please contact: [Protected Info].
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
Nexperia
Other Info
Cabuyao, Laguna
Permanent
Full-time
Permanent
Full-time
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Nexperia
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