Role Summary/Purpose
Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology.
Job Description
Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers
Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost
Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc.
Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up)
Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage
Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges.
Responsible for global end to end hardware project management to ensure best quality and on time delivery
Device testing requirement assessment and Feasibility study
Risk analysis and mitigation planning
Schedule planning and project management
Design execution
Regular review with global internal and external customers
Quality Control and Verification
Work closely with Teradyne Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate
New technology research, new products, new materials evaluation for next generation device testing
Deliver hardware design training and seminars to customers
Requirements
Master's or Bachelor's degree in Electronic Engineering, Micro-Electronics, Mechatronics, Communication Engineering, Automation, Instrumentation and Measurement, Biomedical engineering or similar major related to circuit design or hardware engineering
Good knowledge and understanding of electronic circuit theory and application
Knowledge and experience in multi-layer board design and embedded system design
Knowledge in signal integrity or power integrity theory
Good communication skills, good written and oral English
Meticulous,pay attention to details
Ability to effectively solve problems, open minded
Ability to successfully work in a team, cross-functional environment
Ability to travel oversea for extended period
We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status. We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform crucial job functions, and to receive other benefits and privileges of employment.
Job Segment: Biomedical Engineering, Hardware Engineer, Electronics Engineer, Design Engineer, Thermal Engineering, Engineering
Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology.
Job Description
Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers
Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost
Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc.
Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up)
Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage
Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges.
Responsible for global end to end hardware project management to ensure best quality and on time delivery
Device testing requirement assessment and Feasibility study
Risk analysis and mitigation planning
Schedule planning and project management
Design execution
Regular review with global internal and external customers
Quality Control and Verification
Work closely with Teradyne Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate
New technology research, new products, new materials evaluation for next generation device testing
Deliver hardware design training and seminars to customers
Requirements
Master's or Bachelor's degree in Electronic Engineering, Micro-Electronics, Mechatronics, Communication Engineering, Automation, Instrumentation and Measurement, Biomedical engineering or similar major related to circuit design or hardware engineering
Good knowledge and understanding of electronic circuit theory and application
Knowledge and experience in multi-layer board design and embedded system design
Knowledge in signal integrity or power integrity theory
Good communication skills, good written and oral English
Meticulous,pay attention to details
Ability to effectively solve problems, open minded
Ability to successfully work in a team, cross-functional environment
Ability to travel oversea for extended period
We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status. We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform crucial job functions, and to receive other benefits and privileges of employment.
Job Segment: Biomedical Engineering, Hardware Engineer, Electronics Engineer, Design Engineer, Thermal Engineering, Engineering
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