Engineer I - failure analysisMicrochip Technology
Salary: Agreement
Work form: Full time
Posting Date: 04/02/2026
Deadline: 24/08/2021
Microchip Technology Inc. is a leading provider of embedded control applications. Our product portfolio comprises general purpose and specialized 8-bit, 16-bit, and 32-bit microcontrollers, 32-bit microprocessors, field-programmable gate array (FPGA) products, a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired connectivity and wireless connectivity devices, as well as serial Electrically Erasable Programmable Read Only Memory (EEPROM), Serial Flash memories, Parallel Flash memories, and serial Static Random Access Memory (SRAM). We also license Flash-IP solutions that are incorporated in a broad range of products.
Job Description
Performs depth electrical and physical failure analysis for cutting edge products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Liquid Crystal Analysis (LCA), Optical Beam-Induced Resistance Change (OBIRCH), and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical etch, or combination of different etches), and SEM/EDX analysis.
Works with fellow engineers both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities.
Works with Applications, Customer Quality, Product, Test, Fab, Assembly, and Design Engineering if any help needed to resolve product FA-related issues.
Generates comprehensive failure Analysis Report based on analysis findings.
Develops and implements new failure analysis method.
Job Requirements
Mandatory Skills:
Proficient in electronic/electrical circuit and material analysis.
Ability to effectively extract, analyze, and report data as necessary.
Efficient computer skills (MS Word, MS Access, PowerPoint, and Excel).
Woks well in a fast paced environment with capability to interface throughout all levels and functions of the organization as a team player with little or no supervision.
Excellence knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.
Good interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions.
Knowledgeable in C/C++ programming is advantage.
Preferred Skills:
The ability to manage time and priorities effectively.
Team player.
Fast learner.
Experienced in Failure Analysis laboratory processes and equipment's is advantage.
Percentage of Shift and Longest Time (Enter Standing %, Walking %, Sitting %, Driving %, Inside %, Outside %, Hours standing, walking, sitting, driving, and Usual shift hours and days)
40% standing, 20% walking, 40% sitting
Check Each Essential Physical Functions, Maximum LBS and Working Conditions
Handling, Feeling, Hearing, Seeing, Fumes or Odors, Works Alone, Works Around Others
Microchip Technology
Job Description
Performs depth electrical and physical failure analysis for cutting edge products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Liquid Crystal Analysis (LCA), Optical Beam-Induced Resistance Change (OBIRCH), and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical etch, or combination of different etches), and SEM/EDX analysis.
Works with fellow engineers both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities.
Works with Applications, Customer Quality, Product, Test, Fab, Assembly, and Design Engineering if any help needed to resolve product FA-related issues.
Generates comprehensive failure Analysis Report based on analysis findings.
Develops and implements new failure analysis method.
Job Requirements
Mandatory Skills:
Proficient in electronic/electrical circuit and material analysis.
Ability to effectively extract, analyze, and report data as necessary.
Efficient computer skills (MS Word, MS Access, PowerPoint, and Excel).
Woks well in a fast paced environment with capability to interface throughout all levels and functions of the organization as a team player with little or no supervision.
Excellence knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.
Good interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions.
Knowledgeable in C/C++ programming is advantage.
Preferred Skills:
The ability to manage time and priorities effectively.
Team player.
Fast learner.
Experienced in Failure Analysis laboratory processes and equipment's is advantage.
Percentage of Shift and Longest Time (Enter Standing %, Walking %, Sitting %, Driving %, Inside %, Outside %, Hours standing, walking, sitting, driving, and Usual shift hours and days)
40% standing, 20% walking, 40% sitting
Check Each Essential Physical Functions, Maximum LBS and Working Conditions
Handling, Feeling, Hearing, Seeing, Fumes or Odors, Works Alone, Works Around Others
Microchip Technology
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Philippines
Permanent
Full-time
Permanent
Full-time
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