senior package ArchitectNexperia

What you will do
Support Technology and Package development and Qualification, focusing on new Silicon (Trench), GaN , SiC technologies
Support Capability Studies, Business Group Initiated Projects, and Site initiated projects.
Perform Design for Manufacturability FMEA
Compile, analyze development data, provide recommendations.
Present in Technical Review Board
Write Technical Reports, Technical Papers and publish to Technology groups
Lead/participate Cross Site Package Architect group activities
Present in Technical Forums
Submit Invention Disclosures and Patents
What you will need
Degree/Master in Engineering/Material Sciences related or equivalent.
5 years' experience in for semiconductor packaging. In-depth knowledge of IC/Power packaging is highly desired. * Working experience with AutoCAD, ANSYS Workbench is a plus
Broad knowledge of various material types such as silicon, compound, and metals (e.g., solder) and their material behaviors is required.
Good understanding of general semiconductor packaging processes, materials, technology and trends, such as leadframe, clip design and manufacturing, molding, die attach, etc.
Strong oral and written communication skills
Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
Nexperia

Cabuyao, Laguna
Permanent
Full-time