plating EngineerESPI

Offer description
Negotiable Permanent contract Full Time
QUALIFICATIONS:
 BS degree in Engineering;
 With 3 years' experience in Kiss grind process (E-less plating is an advantage);
 Knowledgeable in manufacturing process, materials selection, and product testing;
 With basic understanding of kiss grind and principles including machine diagram and PLC of plating machine (Pacline) and metrology tools.
RESPONSIBILITIES:
 Provide support as what may be needed to Kiss grind process and may be extended to other teams as needed;
 Perform technical report/activities aligned with wafer plating process;
 Revise/update PFMEA, PCP, WI's based from actions in ECN, MRB, & 8D;
 Generates ECN and other related documents for any process related changes;
 Establish and standardize process control.
Requirements
Minimum education level: Bachelor ́s Degree
3 years of experience
June 8
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