We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
About the job:
As a member of our packaging team, you'll have the chance to interact with many product and business groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Semiconductor Packaging (SCP) organization.
This position shall assume responsibility for the development of new devices, packages, technologies being developed in SCP. You will be responsible for defining, developing, qualifying, and ramping new devices, packages, and technologies to production. You are expected to initiate, lead, and manage face to face meetings and teleconferences with key players and stakeholders across all organizations that are key in ensuring the success of the project.
As a Packaging Engineer at Die-attach, you should be able to develop new package requirements and maintaining its quality for all product groups. Be able to define package requirements for product groups and customer requirements. Develop new package and package qualification programs. Perform integrity analysis of packages utilizing appropriate tools. Perform package characterizations including cost effectiveness studies. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Prepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies. Follow standard practices and procedure in analyzing situations or data from which answers can be readily obtained.
Basic Qualifications:
Candidate must possess at least a Bachelor's degree in Engineering. (EE, ECE, etc; close to DA SME role)
Should have demonstrated strong analytical and technical problem solving and good time management skills that enable on-time delivery of assigned tasks.
Must have the ability to work effectively in a fast-paced and rapidly changing environment and is highly motivated to take initiative and drive results.
Must be proficient in Microsoft Office (particularly PowerPoint and Excel). Can display good data mining and organizational skills with the use of office applications. Experience in analytical software such as spotfire is a plus.
Must have good command of the English language displayed through excellent customer service and follow-ups. Good oral and written communication skills.
Team player and has the ability to work with different levels of management and external stakeholders and/or suppliers. Demonstrated ability to build strong, influential relationships
Must possess keen attention to details, capable of multitasking on complex tasks and responsibilities.
Preferably have a knowledge and experience at Die-attach process.
Specific tool/equipment: ASM, Shinkawa
Understanding of DA process, familiarity with equipment
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
Texas Instruments
As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
About the job:
As a member of our packaging team, you'll have the chance to interact with many product and business groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Semiconductor Packaging (SCP) organization.
This position shall assume responsibility for the development of new devices, packages, technologies being developed in SCP. You will be responsible for defining, developing, qualifying, and ramping new devices, packages, and technologies to production. You are expected to initiate, lead, and manage face to face meetings and teleconferences with key players and stakeholders across all organizations that are key in ensuring the success of the project.
As a Packaging Engineer at Die-attach, you should be able to develop new package requirements and maintaining its quality for all product groups. Be able to define package requirements for product groups and customer requirements. Develop new package and package qualification programs. Perform integrity analysis of packages utilizing appropriate tools. Perform package characterizations including cost effectiveness studies. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Prepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies. Follow standard practices and procedure in analyzing situations or data from which answers can be readily obtained.
Basic Qualifications:
Candidate must possess at least a Bachelor's degree in Engineering. (EE, ECE, etc; close to DA SME role)
Should have demonstrated strong analytical and technical problem solving and good time management skills that enable on-time delivery of assigned tasks.
Must have the ability to work effectively in a fast-paced and rapidly changing environment and is highly motivated to take initiative and drive results.
Must be proficient in Microsoft Office (particularly PowerPoint and Excel). Can display good data mining and organizational skills with the use of office applications. Experience in analytical software such as spotfire is a plus.
Must have good command of the English language displayed through excellent customer service and follow-ups. Good oral and written communication skills.
Team player and has the ability to work with different levels of management and external stakeholders and/or suppliers. Demonstrated ability to build strong, influential relationships
Must possess keen attention to details, capable of multitasking on complex tasks and responsibilities.
Preferably have a knowledge and experience at Die-attach process.
Specific tool/equipment: ASM, Shinkawa
Understanding of DA process, familiarity with equipment
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
Texas Instruments
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Baguio, Benguet
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Pampanga, Central Luzon