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Manager - package design developmentInfineon Technologies Private Limited

Salary: Agreement
Work form: Full time
Posting Date: 12/11/2025
Deadline: 04/03/2021

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Job Description : In your new role you will: * Supports the technical aspect of New Product Introduction (NPI) projects, including risk assessment and mitigation * Ensure thatcustomer requirements are met in terms of timeline, cost and quality Job Description : In your new role you will: Supports the technical aspect of New Product Introduction (NPI) projects , including risk assessment and mitigation Ensure thatcustomer requirements are met in terms of timeline, cost and quality Manage manufacturability and reliability issues of NPI projects and provide innovative solutions Close interaction with chip designer, application team, marketing and business units for new product design and project roadmaps Communicate technical results to customers and stakeholders Support the technical requirements of prototype and sample builds Collaborate with the Project Manager, Quality and Operations personnel within a project team Your ProfileYou are open to new ideas and receptive to other ways of thinking or working and have the passion and the courage to develop new and creative ideas. You demonstrate strong interpersonalskills and know how to establish lasting relationships and networks with colleagues and clients. With your structured working style, you are able to demonstrate high quality standards for yourself and other people. You are best equipped for this task if you have: Master's /Bachelor's Degree in Engineering / Science with package development experience in TO, QFN, Cu Clip, SOIC, QFP, FlipChip , and Laminate based packages Hands-on experiencein specifying design and materials to meet requirements of new packages & products Knowledgeable in industry standards for package reliability test and qualifications Working knowledge of DFMEA during design phase and ability to create strategy to mitigate the risk Familiar with failure analysis techniques Knowledgeable in assembly processes preferably with specialization in wirebond Strong communication skill with ability to interpret package simulation results Skilled in AutoCAD software
Monster

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Philippines
Permanent
Full-time

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Infineon Technologies Private Limited

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