failure analysis TECHNICIAN 3onsemi Cherry Semiconductor.

Job Description
Job Description
FIB Technician Job Description
Job Title: Semiconductor Failure Analysis Focus Ion Beam (FIB) Technician
Job Summary:
We are seeking a highly skilled and motivated semiconductor failure analysis technician with a strong focus on FIB techniques to join our team. The technician will be responsible for assisting in failure analysis on complex semiconductor devices using FIB tools and techniques. The ideal candidate should have experience with FIB operation, sample preparation, and SEM imaging, as well as be able to generate reports on their findings. This job function excludes the use of elemental analysis using EDX and pad metal deposition/circuit modification.
Key Responsibilities:
. Operate and maintain FIB equipment for advanced semiconductor failure analysis.
. Prepare samples for FIB analysis using various techniques, such as chemical etching, mechanical polishing, and ion milling
. Image and analyze samples using FIB and associated imaging techniques such as SEM. ( TEM preparation is optional ).
. Generate reports detailing findings.
. Work with the failure analyst to identify and troubleshoot device failures
. Develop and implement new techniques and methodologies for failure analysis in line with sample preparation for FIB/SEM imaging.
Requirements:
. Associates / Technical degree related to electrical engineering, materials science, physics, or a related technical field
. Minimum of 2 years of experience in semiconductor failure analysis with a focus on FIB techniques
. Experience operating and maintaining FIB equipment, including sample preparation, imaging, and analysis
. Strong problem-solving skills and ability to work independently or as part of a team
. Excellent communication skills and ability to present findings and recommendations to technical and non-technical audiences
Skills:
. Proficient in FIB sample preparation techniques, such as chemical etching, mechanical polishing, and ion milling
. Strong knowledge of FIB imaging techniques and associated tools, such as SEM.
. Basic knowledge of die related failure mechanisms
. Familiarity with use of EDA navigation tools.
. Ability to work with cross-functional teams within failure analysis.
If you meet the above requirements and possess the necessary skills, we encourage you to apply for this exciting and challenging position. The candidate will be working on a night shift basis.
Qualifications
e samples for FIB analysis using various techniques, such as chemical etching, mechanical polishing, and ion milling
. Image and analyze samples using FIB and associated imaging techniques such as SEM. ( TEM preparation is optional ).
. Generate reports detailing findings.
. Work with the failure analyst to identify and troubleshoot device failures
. Develop and implement new techniques and methodologies for failure analysis in line with sample preparation for FIB/SEM imaging.
Requirements:
. Associates / Technical degree related to electrical engineering, materials science, physics, or a related technical field
. Minimum of 2 years of experience in semiconductor failure analysis with a focus on FIB techniques
. Experience operating and maintaining FIB equipment, including sample preparation, imaging, and analysis
. Strong problem-solving skills and ability to work independently or as part of a team
. Excellent communication skills and ability to present findings and recommendations to technical and non-technical audiences
Skills:
. Proficient in FIB sample preparation techniques, such as chemical etching, mechanical polishing, and ion milling
. Strong knowledge of FIB imaging techniques and associated tools, such as SEM.
. Basic knowledge of die related failure mechanisms
. Familiarity with use of EDA navigation tools.
. Ability to work with cross-functional teams within failure analysis.
If you meet the above requirements and possess the necessary skills, we encourage you to apply for this exciting and challenging position. The candidate will be working on a night shift basis.