ENGR STAFF, PROCESS_TLON Semiconductor

Lead a team of wire bond process engineers
Take on technical leadership role for the planning, development, qualification and implementation of manufacturing methods, processes and operations for new products.
Works closely with factory cross-functional team on NPI Projects
Performs package design review, risk analysis and iteration
Creates or process design and performs risk analysis
Performs Design For Manufacturability assessment
Conducts process characterization, qualification and validation
Identifies and conducts studies on materials suitable for the package & process
Performs large scale process validation and performance review
Performs process training to the manufacturing team
Qualifications
Must be a graduate of Mechanical, Electrical, Chemical or Electronics Engineering
Must have at least 10 years' experience in assembly process in a semiconductor company
Must have at least 5 years of package and process development experience in a semiconductor company
Must be trained, have technical knowledge and hands-on experience in wire bond process.
Must have knowledge of properties of common materials used in Semiconductor packaging such as die attach paste, bonding wire and epoxy molding compound.
Must know how to design jigs & tooling for the wire bond process.
Must be trained and experienced with Design of Experiments (DOE), FMEA, APQP and well-versed with common SPC tools
Must be familiar with widely-used SPC software such as SAS-JMP
Must be willing to work extended hours and willing to take on challenges.
Must be proficient in report writing and possess good written and oral communication skills.
ON Semiconductor