engr PRin, package developmentonsemi Cherry Semiconductor.

Job Description
Job Description
Responsible for Package Design for DSO-type (leaded) and SON-type (leadless) packages.
Support Package virtual prototyping activities (simulations).
Performs Design for Manufacturing (DFM) assessments in package and product development projects.
Interact with cross-functional teams on package development and/or production related activities
Interface with direct and indirect material suppliers required for package development activities.
Interface and support other onsemi ATO sites and Product Groups on package design related requests and issues.
Coach / Mentor design technicians.
Perform other task that may be assigned from time to time by immediate supervisor.
Qualifications
Education:
Bachelor's Degree in Engineering
Experience:
Strong Package design experience in leaded and leadless IC / Power packages and laminate-based packages.
Strong knowledge derived from wide exposure in semiconductor packaging assembly processes and equipment.
Knowledgeable in common assembly design rules.
Knowledgeable in leadframe manufacturing process.
Knowledgeable in basic failure analysis methods, reliability testing and material science.
Familiar with APQP
Skills:
Strong skills in AutoCAD or any CAD software. Ability to generate 2D and 3D designs.
Knowledgeable in APD
Strong understanding for Geometric Dimensioning and Tolerancing (GD&T)
Very strong analytic skills and mindset, including problem solving, data analytics and use of data analysis tools (JMP, Excel).
Familiar with project management methodologies