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engr ii, PRocess_tlonsemi

Workplace: Cavite
Salary: Agreement
Work form: Full time
Posting Date: 07/01/2026
Deadline: 19/11/2022

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Characterize, optimize and qualify any new or changes in Die Bond process, materials and machines.
Establish process controls to ensure repeatability of setup of different devices, epoxies and lead frames.
Define tool life of pick-up tip, nozzles and ejector pins.
Initiate and drive improvements in Die Bond process quality, yield, cost, cycle time and capability.
Use appropriate problem-solving methodology and statistical tools to provide disposition, root cause analysis and corrective actions.
Work with different departments to solve quality issues.
Coordinate with different site champions to align with best practices.
Qualifications
Bachelor's Degree in Engineering (Electrical/Electronic/Material Science) or equivalent.
More than 3 years of experience in the Die Bond process.
Knowledgeable in problem-solving methodology and statistical tools. Lean Six Sigma training and certification is an advantage
With hands-on experience in Die Bond machines.
Knowledgeable in PUT, nozzles, ejector pin, epoxies, and LF. Experience in roughened lead-frame is an advantage.
onsemi

Other Info

Carmona, Cavite
Permanent
Full-time

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onsemi

About the company

onsemi jobs

Lapu-Lapu City, Central Visayas


Position engr ii, PRocess_tl recruited by the company onsemi at Cavite, Joboko automatically collects the salary of , finds more jobs on ENGR II, PROCESS_TL or onsemi company in the links above

About the company

onsemi jobs

Lapu-Lapu City, Central Visayas

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