Engineering Technical OperatorON Semiconductor

Perform in-process quality monitoring using different test metrologies: Ball Shear, Wire Pull, Die shear, Cratering Test, and Die Strength Test
Perform heater block temperature profiling on all wire bond machines
Perform functional line test (FLT) of direct materials
Support process characterization, optimization studies, and evaluations of different measurement using HISOMET Toolmaker such as Loop Height, Ball Size, Die Thickness, Bond Pad Opening, Bond Line Thickness, Free Air Ball, X-ray and other engineering responses
Provide support in Qualification of New Equipment, Products and Processes
Perform saw to wire bond process, as needed for engineering evaluations
Ensure availability of complete Total Control Methodology (TCM) packages on all machines
Conduct regular audit on the process controls as defined by Process Engineers
Qualifications
Graduate of a Technical Course
Must know the process flow and basic operation of machines
Flexible and must have a sense of responsibility, aggressiveness, and initiative
Familiar with the safety precautions of the equipment
With effective decision-making skills
Can perform the job with minimal supervision
Proficient in MS Office Applications
ON Semiconductor

Carmona, Cavite
Permanent
Full-time