design TechnicianON Semiconductor
Workplace: Cavite
Salary: Agreement
Work form: Full time
Posting Date: 07/11/2025
Deadline: 30/08/2022
Responsibilities: * Support design and documentation of SOIC / SSOP / TSSOP / QFN new and existing leadframes;
Support design assessment all new leadframes for any design rules violations;
Support Corporate design requests on Case outline (New and revisions) and other design drawing related items as assigned.
Supports other OSPI-Sites and Product Group on design related issues;
Supports Cost reduction programs related to leadframes; and
Perform other task that may be assigned from time to time by immediate supervisor
Qualifications
Experience: * Design / Process / Equipment Technician preferred
Failure Analysis (FA) and Reliability preferred
Exposure in new package development (R&D) for semiconductor applications preferred
Familiar with Process/Equipment capability/limitations of every assembly processes used in the semiconductor assembly.
Skills: * Strong knowledge of AutoCAD software
Know how to create 3D drawings and models is preferred
Working knowledge of ASME-Y14.5 Geometric Dimensioning and Tolerancing (GD&T)
Familiar with leaded and no-leads package design/outlines and leadframe design and it's interaction with the assembly and test process
Familiar with leadframe manufacturing processes and current industry best practices
Familiar with MS Office applications
Excellent communication and presentation skills
Can work with minimal supervision
ON Semiconductor
Support design assessment all new leadframes for any design rules violations;
Support Corporate design requests on Case outline (New and revisions) and other design drawing related items as assigned.
Supports other OSPI-Sites and Product Group on design related issues;
Supports Cost reduction programs related to leadframes; and
Perform other task that may be assigned from time to time by immediate supervisor
Qualifications
Experience: * Design / Process / Equipment Technician preferred
Failure Analysis (FA) and Reliability preferred
Exposure in new package development (R&D) for semiconductor applications preferred
Familiar with Process/Equipment capability/limitations of every assembly processes used in the semiconductor assembly.
Skills: * Strong knowledge of AutoCAD software
Know how to create 3D drawings and models is preferred
Working knowledge of ASME-Y14.5 Geometric Dimensioning and Tolerancing (GD&T)
Familiar with leaded and no-leads package design/outlines and leadframe design and it's interaction with the assembly and test process
Familiar with leadframe manufacturing processes and current industry best practices
Familiar with MS Office applications
Excellent communication and presentation skills
Can work with minimal supervision
ON Semiconductor
Other Info
Carmona, Cavite
Permanent
Full-time
Permanent
Full-time
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ON Semiconductor
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