About the role
As part of Backend Engineering team.
What you will do
Member of cross-site Backend Engineering Team responsible for Clip bond process, reporting to Back End Engineering Manager Assembly
Introduce and drive breakthrough projects for Clip Bond area using internal and external networks.
Liaise with site Engineering teams and ensure cross-site execution of processes and applications
Active sharing of Best practices to different sites and monitor deployment
Drive OEE, Quality and productivity improvement initiatives (in partnership with local sites and suppliers)
Act as the Equipment and tooling expert to be partnered with Package R&D teams, Business group and Procurement
Lead the BEST Users' group and supervise equipment benchmarking across sites. Travel when necessary.
Ensure that Package Roadmap is aligned with Equipment install base and capability limitations.
Support install base optimization, phasing in and phasing out of particular equipment based on technical studies.
Technical support as necessary for customer incidents associated to assembly equipment and resolve at source.
Prepare and justify business cases or proposals for new global projects initiatives.
Other responsibilities may be assigned over time as needed and applicable.
What you will need
Bachelor or Masters of Science in technical discipline (Mechanical, Electrical, Electronics and equivalent)
Project Management Certification and 6 sigma green belt or above certified
Proficient in use of MS office, Minitab, excel for data analysis and TCOO, OEE, ROI, and NPV computations
At least 8 years working experiences as Equipment, Tooling, Process or R&D engineer for Clip attach in Semiconductor Industry.
Strong knowledge and hands-on Machine and Tooling Design experiences
Strong Knowledge on Mechanical, Tooling, Electrical, Electronics, AOI and Mechatronics systems
Knowledgeable in Technical drawings, Metrology, and Fabrication/Machining. Knowledgeable in Tooling Materials and coatings.
Experienced in various DACA machines
Advanced knowledge on process, tooling, materials and semiconductor packaging technologies
Able to write and review detailed equipment purchase specifications.
Able to do Technical reports and deliver presentations
Project management experience: past direct project leadership responsibility from project definition to conclusion phase.
Previous working experiences with suppliers of new machine, and quality or productivity improvement projects.
Cross cultural work experiences
Knowledgeable of structured problem solving approach and Tools (PDCA, 8D, DMAIC, QC Tools, FMEA and the like).
Good command in English, Professional verbal and written communication with internal partners and suppliers
Self-motivated working style, reliable and timely reporting and delivery of KPI's
Strong team work skills across multiple Nexperia and supplier's locations.
Systematic and Assertive work style, must be able to get agreement and support using facts and relevant data
About the team
When you join our company, you join our team. TeamNexperia, an 11,000+ strong international network that both supports and challenges you to grow. We listen to each other and work together with enthusiasm, energy and encouragement to get things done efficiently. Constantly pushing the boundaries, we collaborate with our customers, partners and local communities to meet ever-increasing expectations regardless of the challenges we face. Priding ourselves on going the extra mile to achieve world-class results. And valuing the passion, professionalism and perseverance each one of us brings, to make Nexperia the Efficiency Company.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
Nexperia
As part of Backend Engineering team.
What you will do
Member of cross-site Backend Engineering Team responsible for Clip bond process, reporting to Back End Engineering Manager Assembly
Introduce and drive breakthrough projects for Clip Bond area using internal and external networks.
Liaise with site Engineering teams and ensure cross-site execution of processes and applications
Active sharing of Best practices to different sites and monitor deployment
Drive OEE, Quality and productivity improvement initiatives (in partnership with local sites and suppliers)
Act as the Equipment and tooling expert to be partnered with Package R&D teams, Business group and Procurement
Lead the BEST Users' group and supervise equipment benchmarking across sites. Travel when necessary.
Ensure that Package Roadmap is aligned with Equipment install base and capability limitations.
Support install base optimization, phasing in and phasing out of particular equipment based on technical studies.
Technical support as necessary for customer incidents associated to assembly equipment and resolve at source.
Prepare and justify business cases or proposals for new global projects initiatives.
Other responsibilities may be assigned over time as needed and applicable.
What you will need
Bachelor or Masters of Science in technical discipline (Mechanical, Electrical, Electronics and equivalent)
Project Management Certification and 6 sigma green belt or above certified
Proficient in use of MS office, Minitab, excel for data analysis and TCOO, OEE, ROI, and NPV computations
At least 8 years working experiences as Equipment, Tooling, Process or R&D engineer for Clip attach in Semiconductor Industry.
Strong knowledge and hands-on Machine and Tooling Design experiences
Strong Knowledge on Mechanical, Tooling, Electrical, Electronics, AOI and Mechatronics systems
Knowledgeable in Technical drawings, Metrology, and Fabrication/Machining. Knowledgeable in Tooling Materials and coatings.
Experienced in various DACA machines
Advanced knowledge on process, tooling, materials and semiconductor packaging technologies
Able to write and review detailed equipment purchase specifications.
Able to do Technical reports and deliver presentations
Project management experience: past direct project leadership responsibility from project definition to conclusion phase.
Previous working experiences with suppliers of new machine, and quality or productivity improvement projects.
Cross cultural work experiences
Knowledgeable of structured problem solving approach and Tools (PDCA, 8D, DMAIC, QC Tools, FMEA and the like).
Good command in English, Professional verbal and written communication with internal partners and suppliers
Self-motivated working style, reliable and timely reporting and delivery of KPI's
Strong team work skills across multiple Nexperia and supplier's locations.
Systematic and Assertive work style, must be able to get agreement and support using facts and relevant data
About the team
When you join our company, you join our team. TeamNexperia, an 11,000+ strong international network that both supports and challenges you to grow. We listen to each other and work together with enthusiasm, energy and encouragement to get things done efficiently. Constantly pushing the boundaries, we collaborate with our customers, partners and local communities to meet ever-increasing expectations regardless of the challenges we face. Priding ourselves on going the extra mile to achieve world-class results. And valuing the passion, professionalism and perseverance each one of us brings, to make Nexperia the Efficiency Company.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
Nexperia
Other Info
Cabuyao, Laguna
Permanent
Full-time
Permanent
Full-time
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Nexperia
About the company
Nexperia jobs
Cabuyao, Calabarzon


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Position clip bonding Technical expert recruited by the company Nexperia at Laguna, Joboko automatically collects the salary of , finds more jobs on Clip Bonding Technical Expert or Nexperia company in the links above
About the company
Nexperia jobs
Cabuyao, Calabarzon